| Items | Processing capability (Shenzhen Plant) |
| Layers (max) | 50 |
| Board thickness range | 0.20 mm -- 5.6 mm |
| Outlayer line width / line distance (min) | 3.0/3.0 mil |
| Outlayer copper thickness (max) | 30 OZ |
| Inlayer copper thickness (max) | 15 OZ |
| Aspect ratio (max) | 20:1 |
| Board thickness tolerance | t ≥0.8mm, ± 10%；t＜0.8mm, ± 0.08mm |
| Finished hole size dia(mechanical drill) | 0.15mm -- 6.50mm |
| Hole position tolerances (mechanical drill) | ± 0.05mm |
| Outline tolerance | ± 0.05mm (±2 mil) |
| Soldermask dam width(min) | 0.075mm (green) / 0.125mm (other color) |
| Impedance tolerance | ＜50Ω:±5Ω，≥50Ω:±10% |
| Surface treatment | HAL LF, Immersion gold, ENEPIG, Immersion tin, Immersion silver, OSP, hard gold finger, carbon ink, peelable soldermask, etc. |
| Special process | POFV, buried/blind vias, back-drilling, control-depth milling, hybrided materials PCB, counterbore, copper via plugging, etc. |
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